Ieee transactions on components, packaging and manufacturing technology -Impact Score, Ranking



Ieee transactions on components, packaging and manufacturing technology ranking
Journal Rank8327
Impact Score2.52
H-Index59
SJR0.615

About Ieee transactions on components, packaging and manufacturing technology

Ieee transactions on components, packaging and manufacturing technology is a reputed research journal publish the research in the field/area related to Electrical and Electronic Engineering (Q2); Electronic, Optical and Magnetic Materials (Q2); Industrial and Manufacturing Engineering (Q2). It is published by Institute of Electrical and Electronics Engineers Inc.. The journal has an h-index of 59. The overall rank of this journal is 8327. The more details like ISSN, Journal Quartile, SJR Score, ISSN, and other important details are provided in the following section.



Important Metrics

Journal TitleIEEE Transactions on Components, Packaging and Manufacturing Technology
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISSN21563950
SJR0.615
H-Index59
CountryUnited States
QuartileQ2
Online Submission Submit

Ieee transactions on components, packaging and manufacturing technology Impact Score 2024

The latest impact score of Ieee transactions on components, packaging and manufacturing technology is 2.52.


Credit & Source: Scopus.



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